Get Started with High-Speed Digital

Upon completion, participants will be able to:

• Execute HSD Simulations: Master the ADS workflow to design, simulate, and optimize channels.
• Resolve Signal & Power Integrity Issues: Identify and mitigate crosstalk, jitter, and reflections while optimizing PDN impedance and DC IR drop.
• Apply EM Modeling: Use FEM and Momentum solvers to accurately characterize physical interconnects like vias, traces, and connectors.
• Predict Link Performance: Utilize IBIS-AMI modeling and statistical analysis to ensure target Bit Error Rates (BER) and timing margins.

Designers interested in understanding how to design pre-layout with ADS, to use Channel Simulation, IBIS-AMI models, to import board from other PCB tools and to analyze in ADS in post-layout phase with electromagnetic models (EM model).

ADS Circuit Simulation and Layout

• Master workspace, schematic, and layout fundamentals.
• Perform S-parameter (frequency-domain) simulation.
• Transient/Convolution (time-domain) simulation.

Pre-Layout Analysis and Channel Simulation

• Use CILD and Via Designer to model substrate-specific lines and vias, then integrate them to construct a full physical channel.
• Integrate these models to simulate and analyze a complete end-to-end channel. We will implement IBIS/IBIS-AMI transmitter/receiver models and evaluate performance via eye diagrams in ADS and Keysight software.

SIPro/ PIPro/ Electrothermal

• Cover SIPro EM simulation for layout interconnects, from net identification and setup to S-parameter, TDR, and TDT analysis.
• Extract SIPro results as high-fidelity models for integration into ADS schematics.
• Evaluate power integrity using PIPro for DC IR drop and PDN AC impedance characterization, including integrated thermal and electro-thermal analysis.

ADS Circuit Simulation and Layout

• Lab 1: Simulate circuits and display data. Create a ten-stage LC ladder using subcircuits, add model losses, and simulate a distributed microstrip line.
• Lab 2: Setup transient simulations to compare dispersive (non-TEM) vs. non-dispersive (TEM) lines and analyze interconnect discontinuities.
• Lab 3: Master ADS layer definitions, custom layer creation, and interconnect routing, including non-orthogonal layouts.

Pre-Layout Analysis and Channel Simulation

• Lab 1: Design a differential pair on different layer with CILD & design differential vias with via designer.
• Lab 2: Simulate a high-speed channel to compare backdrilled vs. non-backdrilled vias, optimize channel performance, channel simulation with IBIS-AMI model.
• Lab 3: Evaluate channel performance by swapping generic and IBIS-AMI models for the TX and RX.
• Lab 4: Create a channel and drive a 56 Gbps PAM4 TX with a PAM4 RX using IBIS-AMI models.

SIPro/PIPro Flow, Power-Aware SI Analysis

• Lab 1: Import ODB++ layouts and inspect via Net-based connectivity mode.
• Lab 2: Setup and run SIPro interconnect analyses, from interface navigation to results inspection.
• Lab 3: Setup power-aware SI with signal/power ports and models, then simulate the resulting channel subcircuit.

PIPro DC IR Drop Analysis, PIPro AC Impedance Analysis

• Lab 4: Configure and execute PIPro DC analysis (IR drop), then inspect results and generate test bench subcircuits.
• Lab 5: Transition from DC to AC analysis, inspect impedance plots, and optimize the decoupling capacitor BOM.

Thermal/Electrothermal Analysis

• Lab 6: Define thermal substrate properties and execute thermal, DC, and electrothermal analyses.